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Manufacturing

LED Packaging

core processes are solid crystal, welding, dispensing, peeling, splitting, braiding, bagging and include production of 3528, 2835, 3030, 4040 and two-core to five-core high-power light sources

With light source power from 0.06W to 21W

Surface Mount Technology (SMT)

high precision equipment allows reflow soldering and mounting components for PCB assemblies, including high power light sources, to a placement accuracy of 20 microns

Tooling

is designed and manufactured in our Taizhou facility to ensure tool longevity and tolerance requirements for all component requirements and their efficient processing

Injection Moulding

of components can use a range of machines from 150 tonne up to 1,800 tonne with 2k and 3K capabilities and dedicated custom high-precision machines for optical mouldings

Surface treatment

includes aluminsing utilising Alumet equipment across all production plants, multiple automated hard-coating and anti fog coating lines as well as spray painting